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Excellent manufacturer for PCB,FPC,PCBA,PCB assembly,electronics manufacturing service,OEM&ODM one stop service, and value added service such as product design,program IC design,mould design,component sourcing etc.
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Why choose us
What true advantages you will have if you choose us?
As a professional manufacturer of PCB,FPC,PCBA,electronics manufacturing service,electronics assembly,PCB design,PCB&PCBA one stop service and also can provide value added service, We see quality  is top first  and with good customer sevice ,hope to win you long-term business,We believe those to meet our customers's...
FPC(16)
smart FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Multilayer FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Single layer FPC for control boards
Single layer FPC for control boards
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, foldi
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Multilayer with buried FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Multilayer FPC with 0.1mm holes
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Multilayer gold finger FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Multilayer FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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smart furniture FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Impedance FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Steel stiffer FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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PI Stiffer FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Double layer FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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FR4 Stiffer FPC
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Toleranc
Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, folding Toleranc
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Single layer FPC
Description:Stiffener: positive and negative 0.15mm steel stiffener
Production process: solder coating, plug plating, cover, film type, solder mask type shielded scratch
Surface treatment: Chen Jin (gold) 1 to 2 micro inches
Minimum line width / line d
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, foldi
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Single layer imepedance FPC
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, foldi
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, foldi
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Single layer FPC for industry control
Single layer FPC for industry control
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cov
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film Tolerance: free bending, foldi
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